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 Five slots 3U VPX conduction cooled Chassisconduction cooled vme chassis 0 specification

The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. PXI /. The mini crate can be used on the desk either as a desktop or up-right unit or be installed in a 19. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. VXS offers backwards compatibility for existing VME/VME64x line cards for payload slots. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Over the evolution of its near 40 years of existence, VME-bus has become a worldwide standard and is still used in a wide variety of applications across many different markets. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardCan be provided in a range of ATR sizes. Available in 3U or 6U form factors, the conduction-cooled chassis support a wide range of architectures, including VPX, VME, VME64x, VXS, and CompactPCI. 3U/6U High ATR Chassis with upto 15 Slots Card Area. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. When faced with limited space and challenging cooling conditions, count on SCN to provide a rugged Aitech enclosures in many sizes and footprints. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. Mechanical: 3U VPX conduction cooled as per VITA 62, with wedge locks and extractor handles, 160 mm deep. 8 in. -199 in order to ensure interoperability and common good practices. PSC-6238 3U VITA 62 / 800W 28VDC Input Conduction Cooled PSC-6265 6U VITA 62 / 580W Universal AC Input Conduction Cooled PSC-8724 3U / VITA 62 Low Power High Efficiency with Integrated Hold-upAn open-frame solution for the open-minded engineer. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. The ANSI VITA 62 standard defines the mechanical and electrical specifications for commercial-off the shelf plug-in power supply modules in 3U and 6U format. For a chassis with sealed side walls and lid. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. 3U CompactPCI. Designed for mission critical applications. Hartmann Electronic’s slimmest 19” rack mountable VME solution – The VME64x 1U system. 8” pitch versus a typical 1. The Curtiss-Wright Defense Solutions rugged, conduction-cooled, network centric flight control and management computer is designed to operate in a rugged UAV environment and provides a total flight control solution backed by substantial technical maturity and heritage. Block Diagram. Choice of Power Supply. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow customization of. • Backplane Slots: 9 VME64x J1/J2 Slots. January 3rd, 2021. Designed to meet the requirements of VITA 62 for use in harsh environments. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Load boards convection or conduction cooled • Rear Transition Modules for I/O • Intel & Freescale Single Board Computers • Blade level networking boards (Ethernet, PCI Express) • Rackmount, desktop, and ATR chassis platforms • Ruggedization programs 6U 7-Slot OpenVPX Backplane BKP6-HYB07-11. Description. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Front mounted power switch. Revolutionary design allows for up to 175 watts per. 8 in. C: 70 Input 28VDC: 1. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 5 Air & Conduction-Cooled Ruggedization Levels Standard Features – 1 Megabyte (MB) L2 Cache with private L2 Bus (2 MB for 7410). 8 in. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. VITA46, VITA48 (VPX REDI) and VITA65 (Open VPX) ready accessories, backplanes, development chassis, power supplies, enclosures and rack mounts. 8 (. Compared to conventional wedgelocks, the ICE-Lok® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a system’s card components. The heart of the C164 is Intel’s Broadwell platform, featuring a 5th Generation Intel® Core™ i7 Quad Core processor with integrated Intel® Iris™ Pro Graphics 6200, coupled with a companion Lynx Point. AC and DC power input variants available. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. CompactPCI Serial Chassis. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Motorola – Single board chassis design with natural convection requirement. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Up to 128 Gbytes DDR4 memory for server grade applications. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid VME64x/VITA46/48 VPX 5-slot Development System VME-VME64 6U 162 Series. Victoria BC : 250-727-2890 ©2010 A&A Perfomance Chassis: Site Design by. 8 in. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. These allow heat to conduct through the printed circuit board or through a conduction plate on the backside. Supports air cooled and optionally conduction cooled boards. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. The PSC-6238 front I/O. PICMG 2. PSC-6236 Product DatasheetLiquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. PXI Express Chassis. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. CPCI Chassis . Backplane: Custom 6U, 10 slot open VPX Backplane (Dawn P/N 08-1017654 Rev. The VME195-x mini crate is the perfect choice for small setups with only a few VME64x modules. MIL-STD-704F compliant except 50mSec holdup provided by separate module. GS24. <br /> If you’ve ever dreamed about controlling<br /> your VME system directly from your desk-<br /> top system, your dream. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. 3 VDC output at 75 Watts. VME / VME64x Chassis. 3U / VITA 62 / 800W. Visit Signal Generator. 8-inch pitch backplanes. 1-1997 while providing a low profile, practical packaging solution for high-performance. 1-1997 while providing a low profile, practical packaging solution for high-performance. , the wedgelock supply is located such that they are also cooled through the bulkhead) Mechanical Meets ARINC 404A ATR System Mechanical Design Overall Chassis Dimensions: 10. 3 and/or AMC. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow customization of. (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. To suit 3U & 6U card sizes. 5"L x 5. A conduction cooled chassis offers the highest degree of reliability. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. Advanced airflow design distributes air across external fins in sidewalls. The heat from the internal conduction-cooled. PXI Express Chassis. Aitech Defense. PXI /. Over the evolution of its near 40 years of existence, VME-bus has become a worldwide standard and is still used in a wide variety of. Rackmount 19” chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. This thin VME chassis comes with a 250W cPCI hot-swap power supply and horizontally oriented card slots. Hartmann Electronic designs and manufactures high speed backplanes, electronic Chassis, and more for micro-computer. 2 restricts air flow to the card edges where it’s cooling impact is limited and so conduction cooling and air cooling solutions are usually considered mutually exclusive. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 0 - 7. Curtiss-Wright Controls Embedded Computing announced the availability of conduction-cooled rugged versions of the company's popular CHAMP-FX digital signal processor (DSP) 6U VME64x and VITA-41 engines, making this dual-FPGA board ideal for demanding signal processing applications that require survivability in harsh environments. I designed this 3U VPX 0. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Conduction cooled ATR and 19” rackmount chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. Advanced Cooling Technologies, Inc. Mechanical characteristics of conduction-cooled versions of Eurocard-based circuit card assemblies are described. Heat dissipation by 1 fans (fan tray), cooling bottom. Such means com prises a modified convection-cooled VME compatible chas sis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Get more information on our VME Processors, such as the 6U VME7555 and VME7653 from Orion Technologies on. 64PS1 - North Atlantic Industries. Max. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. CompactPCI Serial Chassis. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. 64PS1 - North Atlantic Industries. 0” pitch for VPX, VXS offers more slots typically in a 19” chassis. (Table 3) The PCI sub-system can support from 2 to 9 PMCs within a standard VME chassis (see P0CC1 datasheet for more detail). VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. Next news articleDawn’s VPX Development System for 6U OpenVPX boards aligns well with the requirements specified within Draft 1. CompactPCI Serial Chassis. These rugged power supplies are available in 200W-1300W power configurations with. 64PS1 - North Atlantic Industries. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. EMI/RFI Power Line Filtering. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. Intelligent VPX Test Module, also System Monitor and Load Board. 2 standard for conduction cooled VME systems. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. Wedge lock conduction cooled module. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 5″L x 6″W x 7. XCalibur1931. 0 specification for use in Mil/Aero VPX systems. Ordering Information: Dawn P/N 11-1017632-01. VPX breaks out from the traditional connector scheme of VMEbus to merge the latest in connector and packaging technology with the latest in bus and serial fabric technology. The Dawn PSC-6236 can be special ordered to support high current single channel applications. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. • (3) DB-9 Ports. from ELMA Electronic Inc. 3U CompactPCI. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 8” slot. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. 20-n FeaturesDescription. Air-Cooled variants are designed to be used in standard industrial VME chassis. Full environmental sealing insures reliable operation in any environment. 2, AMC. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. Rackmount 19” chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. 8 in. This ¾ Long ATR ships with a 6U, 5-slot OpenVPX™ backplane and can accommodate other architectures such as 6U CompactPCI®, VME and VXS. With moveable rear profiles (up to 2. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Aids in locating hot spots in the chassis. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. Ability to work with existing board, frame, or chassis designs. 31 in) / PCB + (7. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Chassis GND: Continuous chassis GND surface where backplane is mounted to rack, comes with M3 screw for chassis GND. The ICE-Lok® thermally enhanced Wedge. Learn About Us. PSC-6265. CCG-6860 conduction-cooled card guide introduced by Dawn VME Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. They are designed for circuit boards. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. Please contact us using the form to the left or at 407-845-1700 to discuss your requirements in detail. VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. CompactPCI Serial Chassis. VXS uses a straightforwardFPGA-Based VME Bridge; IPMI for VPX Systems; Cisco IOS-XE® Embedded Services Routing; Built-In Test (BIT) coreboot & FSP for Intel; Green Hills INTEGRITY. MS216479+RC. 0 specification for use in Mil/Aero VPX systems. The recessed card cage fits 5-slots of VPX at 1-inch pitch with side-to-side push-pull cooling. All external interfaces are accessed through the P2 connector of the VME backplane. 0 specification for use in Mil/Aero VPX systems. VXS (VME Switched Serial) represents an extension of the VME family according to VITA 41. It is conduction-cooled through the card edge/wedgelock. The C162 is based on Intel’s Calpella (Arrandale + ECC) platform comprising an i7 dual-core/four thread (Intel Hyper-Threading® Technology) processor with large integrated on-chip L1, L2 and shared L3 caches as well as a companion QM57 PCH I/O. 08 of Vita65. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Radstone or third-party ATR style enclosures. CompactPCI Serial Chassis. This platform conforms to VITA 1. Dawn VME Intelligent 6U 1600W VITA 62 DC wedgelock conduction cooled power supply (i. Go-No-Go indicators for 12V, 3. Min. 3-n. Rugged Convection- & Conduction-Cooled Boards & Systems. Enclosures that accommodate up to twelve 3U and 6U VME, CompactPCI and VPX conduction-cooled boards. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. 12”W x 19. 3V/25A, 5V/20A, 12V_AUX/1. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. Type 12R2, 9U, 19" Rackmount, MIL-Rugged, Vertical Chassis. PSC-6234 3U 400-Watt 6-channel plug-in or bulkhead mounted Power Supply for conduction cooled OpenVPX systems. This large scale, naval system had a complete HiK™ back-plane and utilize natural convection cooling. An open-frame solution for the open-minded engineer. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard envelope defined by VITA 48. Modernize VME & mezzanine systems with high-performance switching & routing. This specification is applicable to, but not limited to, the VMEbus standard, an internal interconnect (backplane) bus intended for connecting processing elements to their immediate fundamental resources. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. Defense applications require a range packaging approaches. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Input Voltages: 85-264 VAC, 5. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. 2 specification. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). For all rugged environments: Air, Land, and Sea. Embedded RuSHTM technology. RuSH enhanced 3u conduction cooled power supply Wedge-lock style card guides to support conduction cooled boards available as an option. The XPand1201 is a low-cost, flexible, development platform. 2. 3 V. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. Development chassis for VPX and SOSA aligned module payloads. 8-Slot, 3U x 80mm, 1101. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. 3-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Rugged Conduction Cooled Assemblies and Modules. VITA Conduction Cooled Assemblies, 6U260VITA48. About - 1-ACT. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. Operating at wire-speed, these networking modules can be used to architect a. Show More Description. LCR’s field proven chassis have provided over 30 years of reliable service in a wide array of. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. (H) Four 0. Operating temperature range is -40°C to +85°C. Any kind of project specific variations can be provided on request. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 0 inch pitch. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and. Description. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The mini crate can be used on the desk either as a desktop or up-right unit or be installed in a 19. PXI Express Chassis. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. 0” slot pitch), and can also accommodate mezzanine cards as needed. Aitech Defense Systems Inc. Paper ID: SR22628105125 DOI: 10. Rhino - 3U/6U Liquid Cooled. W-IE-NE-R is providing a line of conduction cooled VITA 62 compliant modular plug-in power supplies for VPX applications. Important Notice: Other accessories, manuals, cables, calibration data, software, etc. Provision for mounting GPS/1PPS/10MHZ source in the chassis. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. 08/03/20231 ATR Liquid Cooled : Extended Description: This modular design ATR holds conduction cooled modules with independent dual liquid cooled side walls and a field-proven High Integrity Frame construction. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. RuSH controlled power and cooling supports high current demands and corresponding. Rugged Conduction Cooled Assemblies and Modules. System. VME64x 2U/84HP 4 Slots. Find VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of VME Chassis information. 8” slot. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. With moveable rear profiles (up to 2. 3U 2 Slot OpenVPX Development Chassis. 6U VPX & VME Systems. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. 600-Watt DC/DC Converter, 6U VME. The 50HP wide, rack-mountable enclosure for vertical mounting of boards is outfitted with a 300W ATX power supply and a 1U removable, bottom mount fan tray. Ability to work with existing board, frame, or chassis designs. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. 08 of Vita65. At ACT, we work with our customers to find the best options to reduce conduction gradients and meet. The chassis is cold plate base coupled conduction cooled. 300-400 Watts Pluggable VPX PSU. 600-Watt DC/DC Converter, 6U VME. Load sharing circuitry for up to 4 modules. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules, (ANSI. Card Thickness: 2. Even though conduction cooling typically is the least expensive thermal-management approach for rugged systems, it still introduces some costs in the form of metal card edges that conduct heat. 1ϕ / 3ϕ AC or 28v DC Input power supply (up to 1500w) Input Transients as per MIL-STD-704E / MIL-STD-1275D. LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through. 3 VDC 75-Watt Converter 6U VME. Add to Cart. 5-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Liquid Cooled 1 ATR Chassis, Tall, Short Air Transport, Rugged, for 6U VPX Boards † 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. Extended Description. Conduction-cooled builds are for use in Radstone or third-party ATR style enclosures. 3/4 ATR, conduction-convection cooled. The card slots within a chassis hold the heat frames that PCB boards attach to. VPX-4U-Chassis-Datasheet. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard envelope defined by VITA 48. 6″ form factor. CP931FP is a 6U CompactPCI managed Layer 2, 3, and 4 switch with 24 10/100BaseTX ports and 2…. 700 W VITA62 PSU | conduction cooled | 6 U | 5 HP | DC. Backplanes options - cPCI, PCI, VME64x, VME/VME64, VPX and custom. CPCI Chassis. 6U Conduction Cooled VPX Extender. 8 designs, he says. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. Single/dual cooled side walls. 0 specification for use in Mil/Aero VPX systems. 0 specification. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. This rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. Subrack based, sheet metal, desktop or tower configurations. The 9U, 12R2 is designed to meet the harsh environment of shipboard, airborne, and ground mobile applications per MIL-STD ’s. CompactPCI Serial Chassis. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. 8” slot. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in. As VXS is based on a 0. Dawn VME Products {3 to 5 Slot VME Chassis - Full Size VME Chassis - Standard - TableTop} Elma Electronics Inc. PXI / PXIe Chassis Our PXI and PXIe solutions are designed and. It supports up to two 0. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. or 1. Subrack based, sheet metal, desktop or tower configurations. The VME/PMC 64x Conduction-Cooled Carrier is a 6U VME card that supports up to two (2) PMC modules. 3) CompactPCI Serial is an industrial standard for modular computer systems. CompactPCI Serial Chassis. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. Compare. VPX can offer compatibility through the use of hybrid backplanes with VME/VME64x slots. 6U Card Support (VPX/VME/cPci)- Aurora Chassis. Aitech’s C162 is a high-performance 6U VME SBC for embedded and harsh environment applications. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. It is conduction-cooled through the card edge/wedgelock. Conduction-cooled rugged VME boards fully comply with IEEE 1101. FREMONT, Calif. HiK™ card frames increase thermal conductivity. The most rugged packaging for computing. 3VIO, Short tail connectors on J1, long tail connectors on J2. PXI /. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. Universal AC Input. Expansion adapter chassis using the Intel Thunderbolt 3 interface 1; IO Works Board Drivers 1; IRIG,. 0 specification for use in. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction CooledWatch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. 2 conduction-cooled VME chassis or ANSI/VITA 1-1994 standard air-cooled chassis. 64PS1 - North Atlantic Industries. The wedge locks clamp the VME cards tightly to the thermal interface area, and the heat is moved to the sidewalls of the container, typically an Air-Transport-Rack (ATR). Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. or 1. Thermal barrier coatings (TBCs) are a multilayer coating of a combination of low thermal conductivity, high melting-point ceramics and alloy materials. 54 mm) pin spacing, CompactPCI cards use metric connectors with a 2-millimeter pin spacing, designed to the IEC 1076. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. 5mm) to 1. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. The chassis can accept a front and a Rear Transition Module (RTM). Input Voltages: 19-35 VDC. Our modular, aluminum chassis variants give you many different and interchangeable options for VPX and cPCI, as well as our rugged small form factor VITA 73. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. AccessoriesConduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. (COTS), air or conduction cooled single stage converters according to the ANSI/VITA 62. Our cardcages conform to DIN 41494 and IE 1101. Product Information ATR Chassis For Conduction-Cooled VME Boards Available in multiple ARINC 404A sizes: 1ATRLong, 1ATRShort, 3/4ATRShort, 1/2ATRShort Choice of cooling options: – Fan assisted with integral fan – Using air ducted through a rear plenum – Conduction through base or sidewall – Liquid Pluggable 28 VDC, 115 VAC and 270VDC. Conduction Cooled Version of Pixus VPX Chassis Manager. 15A in 1A steps, 12V_VS1 0A. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. RCOM05 6U CPCI, 6U VME 5 295 x 160 x 248 CPCI, VME Conduction Cooled Dual in; 16-40V DC 65W<br /> RCOM05-ATR-6V Other 5 194 x 124 x 320 CPCI, VME Conduction Cooled 16-40V DC 300W<br />. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. Dawn VME Products is committed to leadership in SOSA modules and infrastructure. Airborne, shipborne and ground deployment. 0 Serial: 2 RS-232/422/485, 4 RS-232 FPGA: Xilinx Artix-7. COTS approach to conduction cooled modular computers COTS mechanical rules for conduction cooled modular board computers in the eurocard form factor were standardized in 199 by IEEE Std 1101. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 4″L x 6″W x 7. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. VPX is specified for 3U and 6U boards and for air cooled, conduction cooled and even liquid cooled chassis. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Over the evolution of its near 40 years of existence,. Up to x16 PCI Express Gen 4. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. 1 6U part # description VME-HF-3U 3U VME Heat Frame Blank Assembly Kit VME-HF-6U 6U VME Heat Frame Blank Assembly Kit CPCI-HF-3U 3U. VPX Test Adapter. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression Coolers) Enclosure. 3 Slot to 5 Slot each. Meets ARINC 404A and.